HAR3900GU-2300

TDK-Micronas GmbH HAR3900GU-2300

Part No:

HAR3900GU-2300

Manufacturer:

TDK-Micronas GmbH

Datasheet:

-

Package:

-

AINNX NO:

69204123-HAR3900GU-2300

Description:

PROGRAMMABLE DUAL DIE 3D SENSORS

Products specifications
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
0 Similar Products Remaining