HAR2425GP

TDK-Micronas GmbH HAR2425GP

Part No:

HAR2425GP

Manufacturer:

TDK-Micronas GmbH

Datasheet:

HAR24xy

Package:

-

AINNX NO:

5398528-HAR2425GP

Description:

TSSOP14

Products specifications
  • Factory Lead Time
    32 Weeks
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
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