CUR3115DZ-A

TDK-Micronas GmbH CUR3115DZ-A

Part No:

CUR3115DZ-A

Manufacturer:

TDK-Micronas GmbH

Datasheet:

-

Package:

8-SOIC (0.154, 3.90mm Width)

AINNX NO:

9575113-CUR3115DZ-A

Description:

SOIC8

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    8-SOIC (0.154, 3.90mm Width)
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
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