TDK Micronas GmbH BC859B

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

3

Transistor Element Material

SILICON

Exterior Housing Material

1

Rohs Code

No

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ITT SEMICONDUCTOR

Operating Temperature-Max

150 °C

Package Body Material

PLASTIC/EPOXY

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE

Transition Frequency-Nom (fT)

150 MHz

JESD-609 Code

e0

ECCN Code

EAR99

Terminal Finish

TIN LEAD

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

LOW NOISE

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Reach Compliance Code

unknown

JESD-30 Code

R-PDSO-G3

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

SINGLE

Polarity/Channel Type

PNP

JEDEC-95 Code

TO-236

Power Dissipation-Max (Abs)

0.3 W

Collector Current-Max (IC)

0.1 A

DC Current Gain-Min (hFE)

200

Collector-Emitter Voltage-Max

30 V

VCEsat-Max

0.65 V

Collector-Base Capacitance-Max

6 pF