TDK Micronas HAL APB V5.1

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Gold

Shell Material

Composite

Shell Sizes

13

Shell Style#

Square Flange

MIL Type

MIL-DTL-38999 III

Voltage, Rating

600 VAC, 850 VDC

Factory Pack QuantityFactory Pack Quantity

1

Mounting Styles

Panel

Insert Arrangement

13-04

Contact Materials

Copper Alloy

Manufacturer

TE Connectivity

Brand

TE Connectivity / DEUTSCH

RoHS

Details

Description/Function

Programmer board for HAL8xy, HAL100x, CUR31xy devices

Unit Weight

13.301987 oz

Tool Is For Evaluation Of

CUR 31xy, HAL 8xy, HAL 100x

For Use With

CUR 31xy, HAL 8xy, HAL 100x

Package

Box

Base Product Number

HAL APV V5

Mfr

TDK-Micronas GmbH

Product Status

Active

For Use With/Related Products

Magnetic Position Sensors

Series

HAL

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Type

Hall Effect Sensor

Number of Positions

4 Position

Subcategory

Circular Connectors

Contact Gender

Pin (Male)

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Circular MIL Spec Connector

Contents

Board(s)

Shell Plating

the outer-most structure on the hull of a steel or aluminum ship or boat.

Nickel

Product

Connectors

Mounting Angle

Straight

Product Category

a particular group of related products.

Circular MIL Spec Connector