TDK InvenSense INMP521ACEZ-R7

Mount

Solder

Shape

Rectangular

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Series

INMP521

Size / Dimension

0.157Lx0.118W 4.00mmx3.00mm

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Not For New Designs

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Termination

Solder Pads

Type

MEMS (Silicon)

Output Type

Digital, PDM

Operating Supply Current

1.2mA

Direction

Omnidirectional

Voltage Range

1.62V~3.63V

Frequency Range

A continuous range or spectrum of frequencies that extends from one limiting frequency to another.

100Hz~16kHz

Sensitivity

-26dB ±3dB @ 94dB SPL

Port Location

Bottom

S/N Ratio

65dB

Height

1.1mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant