TDK InvenSense EV_MOD_CH101-01-02

Mfr

TDK InvenSense

Package

Tray

Product Status

Active

Factory Pack QuantityFactory Pack Quantity

1

Interface Type

I2C

Part # Aliases

MOD_CH101-03-02

Manufacturer

TDK

Brand

TDK InvenSense

Tool Is For Evaluation Of

CH-101

RoHS

Details

Series

-

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Type

Ultrasonic ToF Sensor

Voltage - Supply

1.62V ~ 1.98V

Interface

I2C

Utilized IC / Part

CH101

Supplied Contents

Board(s)

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Distance Sensor Development Tool

Sensor Type

Ultrasonic, 3D Time-of-Flight (ToF)

Sensitivity

-

Embedded

-

Sensing Range

The sensing range of position sensors is the displacement between the sensing face of the sensor and the approaching measurement object that triggers a signal change in the sensor.

4cm ~ 1.2m

Product

Evaluation Modules

Product Category

a particular group of related products.

Distance Sensor Development Tool