EPC2007

TDK-Epcos EPC2007

Part No:

EPC2007

Manufacturer:

TDK-Epcos

Datasheet:

-

Package:

-

AINNX NO:

48263221-EPC2007

Description:

Trans Gan 100V 6A Bumped Die

Products specifications
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
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