TDK-Epcos B65757J0000R087

Core Material

Core materials are produced in a variety of forms including end-grain balsa wood, PVC foam, urethane foam, non-woven core fabrics, and various types of honeycomb materials.

N87

Factory Pack QuantityFactory Pack Quantity

500

Part # Aliases

B65757JR87

Manufacturer

EPCOS / TDK

Brand

EPCOS / TDK

RoHS

Details

Package

Box

Mfr

EPCOS - TDK Electronics

Product Status

Active

Series

B65757J

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Tolerance

- 20 %, + 30 %

Type

Ungapped

Subcategory

Ferrites

Inductance

2.8 uH

Core Size

18 x 11

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Ferrite Cores & Accessories

Product

Ferrite Cores

Product Category

a particular group of related products.

Ferrite Cores & Accessories