B58600E3264B604

TDK-Epcos B58600E3264B604

Part No:

B58600E3264B604

Manufacturer:

TDK-Epcos

Datasheet:

-

Package:

-

AINNX NO:

35320113-B58600E3264B604

Description:

Board Mount Pressure Sensors

Products specifications
  • Factory Pack QuantityFactory Pack Quantity
    1
  • Manufacturer
    EPCOS / TDK
  • Brand
    EPCOS / TDK
  • Series
    C32 ABS WET MEDIA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Wafer Pack
  • Subcategory
    Sensors
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    Pressure Sensors
  • Product Category

    a particular group of related products.

    Board Mount Pressure Sensors
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