TDK Corporation HHM2319B2

Lifecycle Status

PRODUCTION (NOT RECOMMENDED FOR NEW DESIGN) (Last Updated: 2 months ago)

Factory Lead Time

14 Weeks

Package / Case

0805 (2012 Metric)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2011

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Not For New Designs

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

SMD/SMT

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

85°C

Min Operating Temperature

-40°C

Applications

AGSM, DCS, PCS

Frequency

824MHz~915MHz 1.71GHz~1.91GHz

Case Code (Metric)

2012

Case Code (Imperial)

0805

Isolation

28dB

Insertion Loss (dB)

0.3 dB

Coupler Type

Dual Band, Dual Path

Coupling Factor

Coupling Factor (CF) measures the coupling between classes excluding coupling due to inheritance. It is the ratio between the number of actually coupled pairs of classes in a scope (e.g., package) and the possible number of coupled pairs of classes. CF is primarily applicable to object-oriented systems.

-20 ± 1dB

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant