TDK-MSP-V1.2

TDK TDK-MSP-V1.2

Part No:

TDK-MSP-V1.2

Manufacturer:

TDK

Datasheet:

-

Package:

-

AINNX NO:

45949312-TDK-MSP-V1.2

Description:

Magnetic Sensor Development Tools

Products specifications
  • Mount
    Surface Mount
  • Number of Pins
    48
  • Number of Elements
    1
  • RoHS
    Compliant
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    85 °C
  • Min Operating Temperature
    -40 °C
  • Logic Function
    Inverting, Transceiver
  • Number of Bits per Element
    16
  • High Level Output Current

    High-level Output Current IOH The current flowing into the output at a specified high- level voltage. Low-level Output Current IOL The current flowing into the output at a specified low- level output voltage.

    24 mA
  • Low Level Output Current

    The current into the output terminal with input conditions applied that, according to the product specification, will establish a low level at the output.

    24 mA
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