TDK MICRO-POL DONGLE

TDK TDK MICRO-POL DONGLE

Part No:

TDK MICRO-POL DONGLE

Manufacturer:

TDK

Datasheet:

-

Package:

-

AINNX NO:

39140718-TDK MICRO-POL DONGLE

Description:

FS1406/FS1404/FS1403 I2C Interface Programming Board

Products specifications
  • Package
    Bulk
  • Mfr
    PEI-Genesis
  • Product Status
    Active
  • Factory Pack QuantityFactory Pack Quantity
    1
  • Manufacturer
    TDK
  • Brand
    TDK
  • Tool Is For Evaluation Of
    EV1403-5000-A, EV1404-3300-A, EV1406 -1800-A
  • RoHS
    Details
  • For Use With
    Evaluation Boards
  • For Use With/Related Products
    µPOL
  • Series
    *
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Type
    Non-Isolated DC/DC Converter
  • Subcategory
    Development Tools
  • Output Voltage
    -
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    Power Management IC Development Tools
  • Contents
    Board(s)
  • Product
    Accessories
  • Input Voltage
    -
  • Product Category

    a particular group of related products.

    Power Management IC Development Tools
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