Tamura 3FD-212

Factory Lead Time

16 Weeks

Mount

Through Hole

Mounting Type

Through Hole

Number of Pins

8

Weight

77.1g

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

3FD-2xx

Published

2006

Size / Dimension

35.56mm Lx31.00mm W

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

PC Pin

ECCN Code

EAR99

Type

Laminated Core

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

PCB MOUNTABLE

Power Rating

1.1W

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

1.1W

Termination Style

PC Pin

Approval Agency

UL; CSA

Voltage - Isolation

2500Vrms

Max Output Current

The maximum current that can be supplied to the load.

90mA

Power - Max

1.1VA

Voltage - Primary

115V 230V

Primary Winding(s)

Dual

Center Tap

In electronics, a center tap (CT) is a contact made to a point halfway along a winding of a transformer or inductor, or along the element of a resistor or a potentiometer.

No

Voltage - Secondary (Full Load)

Parallel 6.3V Series 12.6V

Number of Secondary Winding

2

VA Rating

1.1 VA

Height

25.4mm

Height Seated (Max)

38.00mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant

Lead Free

Lead Free