Taiyo Yuden MLS25070-2100-19

Shape

Round

Frequency-Self-Resonant

900Hz

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Published

2004

Size / Dimension

1.193Lx0.984W 30.30mmx25.00mm

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Solder Pads

Type

General Purpose

Frequency Range

A continuous range or spectrum of frequencies that extends from one limiting frequency to another.

500Hz~10kHz

Port Location

Top

Efficiency - dBA

78.00

Efficiency - Type

Sound Pressure Level (SPL)

Height Seated (Max)

0.035 0.90mm