Taiwan Semiconductor TESDU12V RZ

EU RoHS

Compliant

ECCN (US)

EAR99

Automotive

No

PPAP

No

Direction Type

Bi-Directional

Number of Elements per Chip

1

Maximum Working Voltage (V)

12

Maximum Clamping Voltage (V)

25

Maximum Leakage Current (uA)

2

Maximum Power Dissipation (mW)

150

Peak Pulse Power Dissipation (W)

25

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

150

Mounting

Surface Mount

Package Width

1(Max)

Package Length

1.8(Max)

PCB changed

2

Standard Package Name

SMD

Supplier Package

Case 0603(1608Metric)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Type

TVS

Pin Count

a count of all of the component leads (or pins)

2

Configuration

Single