HDBS103G RD

Taiwan Semiconductor HDBS103G RD

Part No:

HDBS103G RD

Datasheet:

-

Package:

-

AINNX NO:

31804442-HDBS103G RD

Description:

Products specifications
  • EU RoHS
    Compliant with Exemption
  • ECCN (US)
    EAR99
  • SVHC
    Yes
  • SVHC Exceeds Threshold
    Yes
  • Automotive
    No
  • PPAP
    No
  • Bridge Type
    Single Phase
  • Peak Reverse Repetitive Voltage (V)
    200
  • Peak Average Forward Current (A)
    1@Ta=40C
  • Peak RMS Reverse Voltage (V)
    140
  • Peak Non-Repetitive Forward Surge Current (A)
    50
  • Peak Forward Voltage (V)
    1
  • Peak Reverse Current (uA)
    5
  • Peak Reverse Recovery Time (ns)
    50
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    150
  • Mounting
    Surface Mount
  • Package Height
    3.3(Max)
  • Package Width
    6.5(Max)
  • Package Length
    8.51(Max)
  • PCB changed
    4
  • Standard Package Name
    Case DB-S
  • Supplier Package
    Case DB-S
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape and Reel
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Pin Count

    a count of all of the component leads (or pins)

    4
  • Configuration
    Single
  • Diode Type
    Ultra Fast Recovery Rectifier
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