Taiwan Semiconductor ES1J F2

Mount

Surface Mount

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Pins

2

Diode Element Material

SILICON

Number of Terminals

2

EU RoHS

Compliant with Exemption

ECCN (US)

EAR99

HTS

8541.10.00.80

SVHC

Yes

SVHC Exceeds Threshold

Yes

Automotive

No

PPAP

No

Maximum DC Reverse Voltage (V)

600

Peak Reverse Repetitive Voltage (V)

600

Maximum Continuous Forward Current (A)

1

Peak Non-Repetitive Surge Current (A)

30

Peak Forward Voltage (V)

1.7

Peak Reverse Current (uA)

5

Peak Reverse Recovery Time (ns)

35

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

150

Mounting

Surface Mount

Package Height

2.3(Max)

Package Width

2.83(Max)

Package Length

4.6(Max)

PCB changed

2

Standard Package Name

DO-214-AC

Supplier Package

SMA

Lead Shape

Inward L-Lead

Peak Rep Rev Volt

600(V)

Peak Forward Voltage

1.7(V)

Operating Temperature Classification

Military

Avg. Forward Curr (Max)

1

Package Type

SMA

Peak Reverse Recovery Time

35(ns)

Maximum Forward Current

1000(mA)

Rev Curr

5(uA)

Operating Temp Range

-55C to 150C

Rev Recov Time

35(ns)

Rad Hardened

No

Rectifier Type

Switching Diode

RoHS

Compliant

Package Description

R-PDSO-C2

Package Style

SMALL OUTLINE

Moisture Sensitivity Levels

1

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-55 °C

Reflow Temperature-Max (s)

30

Operating Temperature-Max

150 °C

Rohs Code

Yes

Manufacturer Part Number

ES1JF2

Package Shape

RECTANGULAR

Manufacturer

Taiwan Semiconductor

Number of Elements

1

Part Life Cycle Code

Active

Ihs Manufacturer

TAIWAN SEMICONDUCTOR CO LTD

Risk Rank

5.19

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

JESD-609 Code

e3

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

NRND

ECCN Code

EAR99

Type

Switching Diode

Terminal Finish

Matte Tin (Sn)

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

150 °C

Min Operating Temperature

-55 °C

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

C BEND

Peak Reflow Temperature (Cel)

260

Reach Compliance Code

compliant

Pin Count

a count of all of the component leads (or pins)

2

JESD-30 Code

R-PDSO-C2

Configuration

Single

Element Configuration

The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

Single

Diode Type

RECTIFIER DIODE

Forward Current

Current which flows upon application of forward voltage.

1000(mA)

Output Current-Max

1 A

Forward Voltage

the amount of voltage needed to get current to flow across a diode.

1.7(V)

Peak Reverse Current

The maximum voltage that a diode can withstand in the reverse direction without breaking down or avalanching.If this voltage is exceeded the diode may be destroyed. Diodes must have a peak inverse voltage rating that is higher than the maximum voltage that will be applied to them in a given application.

5(uA)

Rep Pk Reverse Voltage-Max

600 V

JEDEC-95 Code

DO-214AC

Peak Non-Repetitive Surge Current

30(A)

Reverse Recovery Time-Max

0.035 µs

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

Lead Free

Contains Lead