Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
YES
Material
aluminium
Number of Terminals
2
Transistor Element Material
SILICON
Exterior Housing Material
1
Transport packaging size/quantity
42*28*18.5/1000
Maximum current
19 A
Noal voltage
30 (AC/DC) Vmin
Mounting hole size
Ф12 mm
Mounting method
panel/ soldering
Rohs Code
Yes
Part Life Cycle Code
Active
Ihs Manufacturer
TAITRON COMPONENTS INC
Package Description
DPAK-3
Operating Temperature-Max
150 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE
Transition Frequency-Nom (fT)
40 MHz
Type of heatsink
extruded
Heatsink shape
grilled
Colour
aluminium
Material finishing
raw
Mounting
for back plate
Heatsinks features
hollow fin geometry
Plate thickness
20mm
Gross weight
700 g
ECCN Code
EAR99
Connector type
socket (F) Ф4 mm, green isolator color
Terminal Position
SINGLE
Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
GULL WING
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Depth
32 mm
Reach Compliance Code
unknown
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
R-PSSO-G2
Configuration
SINGLE
Transistor Application
SWITCHING
Polarity/Channel Type
PNP
JEDEC-95 Code
TO-252
Collector Current-Max (IC)
8 A
DC Current Gain-Min (hFE)
40
Collector-Emitter Voltage-Max
80 V
2nd Connector Number of Positions Loaded
for fan motors
Diameter
14.5 mm
Length
0.4m
Width
70mm
Height
23mm