HCI2012F-3N9J

TAI-TECH Advanced Electronics Co., Ltd. HCI2012F-3N9J

Part No:

HCI2012F-3N9J

Datasheet:

-

Package:

0805 (2012 Metric)

AINNX NO:

69642075-HCI2012F-3N9J

Description:

IND 3.9NH 0.15OHM 300MA

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    0805 (2012 Metric)
  • Supplier Device Package
    0805
  • Mfr
    TAI-TECH Advanced Electronics Co., Ltd.
  • Material-Core
    Ceramic
  • Frequency-Self-Resonant
    6GHz
  • Inductance Frequency-Test
    100 MHz
  • Series
    HCI2012
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 85°C
  • Size / Dimension
    0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Tolerance
    ±5%
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Type
    Multilayer
  • Current Rating (Amps)
    300 mA
  • Shielding
    Unshielded
  • Inductance
    3.9 nH
  • DC Resistance (DCR)
    150mOhm Max
  • Q @ Freq
    12 @ 100MHz
  • Height Seated (Max)
    0.041" (1.05mm)
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