Susumu HAP-BME-20-13N01

Factory Lead Time

14 Weeks

Shape

Round

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Published

2008

Size / Dimension

0.787Dia 20.00mm

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Solder Pads

Type

General Purpose

Frequency Range

A continuous range or spectrum of frequencies that extends from one limiting frequency to another.

1050Hz~1450Hz

Port Location

Top

Efficiency - dBA

72.00

Efficiency - Type

Sound Pressure Level (SPL)

Efficiency - Testing

100mm

Height

600μm

Height Seated (Max)

0.035 0.90mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant