Surge Components Inc BCW61B

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Material

polyolefin

Number of Terminals

3

Transistor Element Material

SILICON

Exterior Housing Material

1

Part Life Cycle Code

Active

Ihs Manufacturer

SURGE COMPONENTS INC

Package Body Material

PLASTIC/EPOXY

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE

Transition Frequency-Nom (fT)

100 MHz

Weight gross

16.87

Transport package size/quantity

103*26*26/400

Diameter before shrinkage

6 mm

Diameter after shrinkage

2 mm

Nominal diameter

6 mm

Wall thickness before shrinkage

0.53 mm

Shrinkage temperature

100 deg. C

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

supplied in packs of 1.0 m increments

ECCN Code

EAR99

Type

Heat-shrink tubing with adhesive layer

Color

red

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Reach Compliance Code

compliant

JESD-30 Code

R-PDSO-G3

Working voltage

≤1500 V

Configuration

SINGLE

Note

Possible deviation of the diameter to shrinkage up to +1.5 mm

Transistor Application

SWITCHING

Polarity/Channel Type

PNP

Operating temperature range

-55…+125 deg. C

Collector Current-Max (IC)

0.1 A

DC Current Gain-Min (hFE)

80

Collector-Emitter Voltage-Max

32 V

Shrink ratio

3 : 1

Length

1000 mm