STMicroelectronics TSC1641IQT

Mounting Type

Surface Mount

Package / Case

10-DFN Exposed Pad

Supplier Device Package

10-DFN (3x3)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Number of Channels

2

Number of Bits

16

Voltage - Supply, Analog

2.7V ~ 3.6V

Voltage - Supply, Digital

2.7V ~ 3.6V