STMicroelectronics STBP112CVDJ6F

Mounting Type

Surface Mount

Package / Case

8-WFDFN Exposed Pad

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

JESD-609 Code

e3

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

ECCN Code

EAR99

Terminal Finish

Matte Tin (Sn) - annealed

Applications

General Purpose

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Base Part Number

STBP112

Number of Circuits

1

Interface IC Type

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Voltage - Working

28V

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant