STMicroelectronics RHFAC2525K01V

ECCN (US)

EAR99

HTS

8542.39.00.01

Fanout

1:8

Number of Outputs per Chip

8

Maximum Propagation Delay Time @ Maximum CL (ns)

Absolute Propagation Delay Time (ns)

8.5

Minimum Operating Supply Voltage (V)

2

Typical Operating Supply Voltage (V)

3.3|2.5|5

Maximum Operating Supply Voltage (V)

5.5

Maximum Quiescent Current (mA)

0.05

Maximum Power Dissipation (mW)

500

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

125

Supplier Temperature Grade

Military

Standard Package Name

FPAK

Supplier Package

CFPAK

Mounting

Surface Mount

Package Height

2.72(Max)

Package Length

9.73(Max)

Package Width

6.5(Max)

PCB changed

14

Lead Shape

Flat

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Fanout Buffer

Pin Count

a count of all of the component leads (or pins)

14

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS non-compliant