STMicroelectronics M28W320FCT70ZB6E

EU RoHS

Compliant

ECCN (US)

3A991.b.1.a

Automotive

No

PPAP

No

Cell Type

NOR

Chip Density (bit)

32M

Block Organization

Asymmetrical

Location of Boot Block

Top

Address Bus Width (bit)

21

Number of Bits/Word (bit)

16

Number of Words

2M

Programmability

Yes

Timing Type

Asynchronous

Max. Access Time (ns)

70

Maximum Erase Time (S)

10/Main Block

Maximum Programming Time (ms)

0.2/Word

OE Access Time (ns)

20

Interface Type

Parallel

Minimum Operating Supply Voltage (V)

2.7

Typical Operating Supply Voltage (V)

3|3.3

Maximum Operating Supply Voltage (V)

3.6

Programming Voltage (V)

2.7 to 3.6|11.4 to 12.6

Operating Current (mA)

18

Program Current (mA)

20

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Command Compatible

Yes

ECC Support

No

Support of Page Mode

Yes

Mounting

Surface Mount

Package Height

1

Package Width

6.37

Package Length

6.39

PCB changed

47

Standard Package Name

BGA

Supplier Package

TFBGA

Lead Shape

Ball

RoHS

Non-Compliant

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Pin Count

a count of all of the component leads (or pins)

47

Architecture

Sectored

Sector Size

8Kbyte x 8|64Kbyte x 63

Boot Block

Yes