BALF-NRF01E3

STMicroelectronics BALF-NRF01E3

Part No:

BALF-NRF01E3

Manufacturer:

STMicroelectronics

Datasheet:

BALF-NRF01E3

Package:

6-XFLGA

ROHS:

AINNX NO:

8502487-BALF-NRF01E3

Category:

Balun

Description:

BALUN 2.4GHZ-2.54GHZ 6XFLGA

Products specifications
  • Factory Lead Time
    11 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    6-XFLGA
  • Number of Pins
    6
  • Impedance-Unbalanced/Balanced
    50 / -Ohm
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Cut Tape (CT)
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    125°C
  • Min Operating Temperature
    -40°C
  • Frequency
    2.54kHz
  • Lead/Base Style
    Solder
  • Frequency Range

    A continuous range or spectrum of frequencies that extends from one limiting frequency to another.

    2.4GHz~2.54GHz
  • Insertion Loss (Max)
    2.2dB
  • Return Loss-Min
    15dB
  • Phase Difference

    the difference in phase angle between two sinusoids or phasors. In a three-phase system, the phase difference between conductors is one-third of a cycle.

  • REACH SVHC
    No SVHC
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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