START International TSPS12-10

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Objectives typically have magnifying powers that range from 1:1 (1X) to 1:1 (1X), with the most common powers being 4X (or 5X), 1X, 2X, 4X (or 5X), and 1X.