Soberton Inc. SP-1508

Factory Lead Time

10 Weeks

Shape

Rectangular

Material - Cone

Polyetheretherketone (PEEK)

Material - Magnet

Nd-Fe-B

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Series

SP Micro Speaker

Published

2016

Size / Dimension

0.591Lx0.315W 15.00mmx8.00mm

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Termination

Solder Pads

Type

General Purpose

Power Rating

500mW

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

700mW

Impedance

In electrical engineering, impedance is the opposition to alternating current presented by the combined effect of resistance and reactance in a circuit.

7Ohms

Power - Max

700mW

Frequency Range

A continuous range or spectrum of frequencies that extends from one limiting frequency to another.

300Hz~5kHz

Power - Rated

500mW

Port Location

Top

Efficiency - dBA

85.00

Efficiency - Type

Sound Pressure Level (SPL)

Efficiency - Testing

100mW/100mm

Height

2.9mm

Height Seated (Max)

0.102 2.60mm

Length

15mm

Width

8mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant