CLA4609-086LF

Skyworks Solutions Inc. CLA4609-086LF

Part No:

CLA4609-086LF

Package:

2-VDFN Exposed Pad

ROHS:

AINNX NO:

3659032-CLA4609-086LF

Category:

Diodes - RF

Description:

DIODE LIMITER SILICON 3QFN

Products specifications
  • Factory Lead Time
    11 Weeks
  • Mount
    Surface Mount
  • Package / Case
    2-VDFN Exposed Pad
  • Number of Pins
    3
  • Diode Element Material
    SILICON
  • Number of Elements
    1
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    175°C TJ
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Published
    2009
  • JESD-609 Code
    e3
  • Pbfree Code
    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Number of Terminations
    2
  • Termination
    SMD/SMT
  • ECCN Code
    EAR99
  • Terminal Finish
    Tin (Sn)
  • Applications
    LIMITER
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8541.10.00.80
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    3W
  • Terminal Position
    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    C BEND
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    40
  • Base Part Number
    CLA4609-086
  • Pin Count

    a count of all of the component leads (or pins)

    3
  • JESD-30 Code
    S-PDSO-C2
  • Max Current Rating
    200mA
  • Element Configuration

    The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

    Common Anode
  • Diode Type
    PIN - Single
  • Power Dissipation

    the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

    3W
  • Case Connection
    CATHODE
  • Forward Current

    Current which flows upon application of forward voltage.

    1.5A
  • Capacitance @ Vr, F
    0.14pF @ 6V 1MHz
  • Reverse Voltage

    the voltage drop across the diode if the voltage at the cathode is more positive than the voltage at the anode

    250V
  • Reverse Voltage (DC)
    250V
  • Frequency Band
    HIGH FREQUENCY TO C B
  • Resistance @ If, F
    1.5Ohm @ 10mA 500MHz
  • Diode Capacitance-Max
    0.6pF
  • Minority Carrier Lifetime-Nom
    1.1 μs
  • Diode Res Test Current
    10mA
  • Diode Res Test Frequency
    100MHz
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free
    Lead Free
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