Skyetek Inc SM-MN-00-SPI

Package / Case

Module

Supplier Device Package

Module

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

SkyeModule™ M1-Mini

Published

2011

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Discontinued

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Type

Read/Write

Frequency

13.56MHz

Interface

I2C, SPI, TTL

Standards

ISO 14443, ISO 15693, ISO 18000-3