SM671PXC L BFSS

Silicon Motion, Inc. SM671PXC L BFSS

Part No:

SM671PXC L BFSS

Datasheet:

-

Package:

153-TBGA

AINNX NO:

69198632-SM671PXC L BFSS

Category:

Memory

Description:

IC FLASH 160GBIT UFS3.1 153BGA

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    153-TBGA
  • Supplier Device Package
    153-BGA (11.5x13)
  • Mfr
    Silicon Motion, Inc.
  • Memory Types
    Non-Volatile
  • Base Product Number
    SM671
  • Series
    Ferri-UFS ™
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -25°C ~ 85°C
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    160Gbit
  • Memory Format
    FLASH
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    UFS3.1
  • Memory Organization
    20G x 8
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