Silicon Motion SM668GXB-ACS

Mounting Type

Surface Mount

Package / Case

100-LBGA

Supplier Device Package

100-BGA (14x18)

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8542.32.00.71

Automotive

Yes

PPAP

Unknown

Cell Type

SLC NAND

Chip Density (bit)

256G

Programmability

Yes

Timing Type

Synchronous

Interface Type

Serial e-MMC

Minimum Operating Temperature (°C)

-25

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Commercial

Command Compatible

Yes

ECC Support

Yes

Support of Page Mode

No

Mounting

Surface Mount

Package Height

1.4

Package Width

14

Package Length

18

PCB changed

153

Supplier Package

BGA

Package

Bulk

Mfr

Silicon Motion, Inc.

Product Status

Active

Memory Types

Non-Volatile

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-25°C ~ 85°C

Series

Ferri-eMMC®

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

LTB

Technology

FLASH - NAND (SLC)

Voltage - Supply

-

Pin Count

a count of all of the component leads (or pins)

153

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

256Gbit

Memory Format

FLASH

Memory Interface

An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

eMMC

Write Cycle Time - Word, Page

-

Boot Block

No

Memory Organization

32G x 8