SM662GAC-BDS
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50927568-SM662GAC-BDS
TLC NAND Flash Serial e-MMC 512G-bit Automotive 153-Pin BGA Tray
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
SM662PEE-BDS
Silicon MotionSM662PEE-BDSSM662GEE-BDS
Silicon MotionSM662GEE-BDSMC619GXCDCC1
Silicon MotionSATA III DRAM + MLC based 64GBMB659GXBDCC1
Silicon MotionSATA III DRAM + SLCmode basedMB619GXCDCC1
Silicon MotionSATA III DRAM + MLC based 64GBMB659GXADCC1
Silicon MotionSATA III DRAM + SLCmode basedMB619GXADCC1
Silicon MotionSATA III DRAM + MLC based 16GBSM671PBE-BFST
Silicon MotionIC FLASH UFS2.1 153BGASM671PBC-AFSS
Silicon MotionFERRI-UFS 3D 20GB SLC 153BGASM662PEC-BDSS
Silicon MotionFERRI-EMMC 3D I 20GB SLC 153BGA