ME619GXELDF3

Silicon Motion ME619GXELDF3

Part No:

ME619GXELDF3

Manufacturer:

Silicon Motion

Datasheet:

-

Package:

-

AINNX NO:

40551651-ME619GXELDF3

Description:

SSD 256GB BGA

Products specifications
  • Material
    Polyolefin (PO)
  • Weight
    -
  • Lead Free Status / RoHS Status
    --
  • Inner Diameter - Supplied
    3.000 (76.20mm)
  • Inner Diameter - Recovered
    0.750 (19.05mm)
  • Package
    Bulk
  • Base Product Number
    ME619
  • Mfr
    Silicon Motion, Inc.
  • Product Status
    Active
  • Memory Types
    -
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -55°C ~ 90°C
  • Series
    HRHF
  • Size / Dimension
    20.00mm x 16.00mm
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    --
  • Type
    Tubing, Flexible
  • Color
    Clear
  • Voltage - Supply
    -
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    256GB
  • Current - Max
    -
  • Shrinkage Ratio
    5.6 to 1
  • Shrink Temperature

    Common polyolefin materials have a recommended shrink temperature of around 9°C, although other materials offer shrink temperatures, notably Teflon, as high as 25°C.

    80°C
  • Form Factor

    an aspect of design which defines and prescribes the size, shape, and other physical specifications of hardware components, particularly in electronics and electronic packaging

    BGA
  • Speed - Read
    -
  • Speed - Write
    -
  • Features
    Flame Retardant
  • Length
    0.833 (254.00mm, 10.00)
  • Recovered Wall Thickness
    0.120 (3.05mm)
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