Silicon Labs EFM32TG210F32-QFN32

Factory Lead Time

6 Weeks

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Gold

Mounting Type

Surface Mount

Package / Case

32-VQFN Exposed Pad

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Pins

32

Data Converters

A/D 4x12b; D/A 1x12b

Number of I/Os

24

RAM(byte)

4096

Watchdog Timers

Yes

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C~85°C TA

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Series

Tiny Gecko

Published

2012

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Not For New Designs

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Number of Terminations

32

Terminal Position

QUAD

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

NO LEAD

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Supply Voltage

3V

Terminal Pitch

The center distance from one pole to the next.

0.65mm

Frequency

32MHz

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Supply Voltage-Max (Vsup)

3.8V

Power Supplies

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

1.85/3.8V

Supply Voltage-Min (Vsup)

1.98V

Interface

EBI/EMI, I2C, I2S, IrDA, SPI, UART, USART

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

32kB

Oscillator Type

Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

Internal

RAM Size

4K x 8

Voltage - Supply (Vcc/Vdd)

1.85V~3.8V

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER, RISC

Core Processor

ARM® Cortex®-M3

Peripherals

Brown-out Detect/Reset, DMA, POR, PWM, WDT

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

FLASH

Core Size

32-Bit

Program Memory Size

32KB 32K x 8

Connectivity

EBI/EMI, I2C, IrDA, SmartCard, SPI, UART/USART

Bit Size

32

Has ADC

YES

DMA Channels

YES

Data Bus Width

32b

PWM Channels

YES

DAC Channels

YES

Number of Timers/Counters

2

Core Architecture

ARM

CPU Family

CORTEX-M3

Number of Programmable I/O

24

Length

6mm

Height Seated (Max)

0.9mm

REACH SVHC

Unknown

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant