C8051F360DK

Silicon Labs C8051F360DK

Part No:

C8051F360DK

Manufacturer:

Silicon Labs

Datasheet:

C8051F360-369

Package:

TQFP

AINNX NO:

7750595-C8051F360DK

Description:

KIT DEV FOR C8051F360 FAMILY

Products specifications
  • Factory Lead Time
    2 Weeks
  • Mounting Type
    Fixed
  • Package / Case
    TQFP
  • Number of Pins
    6
  • Weight
    50.008559mg
  • Number of I/Os
    39
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Published
    2001
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Not For New Designs
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Type
    MCU 8-Bit
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    15V
  • Interface
    UART, USB
  • RAM Size
    1.3kB
  • Number of Bits
    8
  • Core Processor
    8051
  • Data Bus Width
    8b
  • Utilized IC / Part
    C8051F36x
  • Density
    250 kb
  • Evaluation Kit
    Yes
  • Contents
    Board(s), Cable(s), Power Supply, USB Debug Adapter Programmer
  • Board Type
    Evaluation Platform
  • REACH SVHC
    Unknown
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    Non-RoHS Compliant
  • Lead Free
    Lead Free
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