C8051F330-GM

Silicon Labs C8051F330-GM

Part No:

C8051F330-GM

Manufacturer:

Silicon Labs

Datasheet:

C8051F330-35

Package:

20-VFQFN Exposed Pad

ROHS:

AINNX NO:

4814813-C8051F330-GM

Description:

MCU 8-bit C8051F33x 8051 CISC 8KB Flash 3.3V 20-Pin QFN

Products specifications
  • Factory Lead Time
    6 Weeks
  • Contact Plating

    Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

    Tin
  • Mounting Type
    Surface Mount
  • Package / Case
    20-VFQFN Exposed Pad
  • Number of Pins
    20
  • Supplier Device Package
    20-MLP (4x4)
  • Data Converters
    A/D 16x10b; D/A 1x10b
  • Memory Types
    FLASH
  • Number of I/Os
    17
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Series
    C8051F33x
  • Published
    2000
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Not For New Designs
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    85°C
  • Min Operating Temperature
    -40°C
  • Frequency
    25MHz
  • Base Part Number
    C8051F33
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    3.3V
  • Number of Channels
    3
  • Interface
    2-Wire, I2C, SMBus, SPI, UART, USART
  • Max Supply Voltage

    In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

    3.6V
  • Min Supply Voltage

    The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.

    2.7V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    8kB
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    Internal
  • Speed
    25MHz
  • RAM Size
    768 x 8
  • Voltage - Supply (Vcc/Vdd)
    2.7V~3.6V
  • Core Processor
    8051
  • Peripherals
    POR, PWM, Temp Sensor, WDT
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    FLASH
  • Core Size
    8-Bit
  • Program Memory Size
    8KB 8K x 8
  • Connectivity
    SMBus (2-Wire/I2C), SPI, UART/USART
  • Access Time
    25 μs
  • Data Bus Width
    8b
  • Number of Timers/Counters
    4
  • Core Architecture
    8051
  • Max Frequency
    25MHz
  • Number of Programmable I/O
    17
  • Number of UART Channels
    1
  • Number of ADC Channels
    16
  • Number of PWM Channels
    3
  • Number of I2C Channels
    1
  • Number of SPI Channels
    1
  • Height
    880μm
  • Length
    4mm
  • Width
    4mm
  • REACH SVHC
    Unknown
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
  • Lead Free
    Lead Free
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