Silicon Labs C8051F311-GM

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Tin

Mounting Type

Surface Mount

Package / Case

28-VFQFN Exposed Pad

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Pins

28

Data Converters

A/D 17x10b

Number of I/Os

25

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C~85°C TA

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Series

C8051F31x

JESD-609 Code

e3

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Not For New Designs

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

28

Terminal Position

QUAD

Supply Voltage

3V

Frequency

25MHz

Base Part Number

C8051F31

Pin Count

a count of all of the component leads (or pins)

28

Lead Pitch

800μm

Operating Supply Voltage

The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

3.3V

Supply Voltage-Max (Vsup)

3.6V

Row Spacing

the space needed between rows to allow room for people or farm equipment to get through.

5 mm

Number of Channels

5

Interface

2-Wire, I2C, SMBus, SPI, UART, USART

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

16kB

Oscillator Type

Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

Internal

RAM Size

1.25K x 8

Voltage - Supply (Vcc/Vdd)

2.7V~3.6V

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER

Number of Bits

8

Core Processor

8051

Peripherals

POR, PWM, Temp Sensor, WDT

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

FLASH

Core Size

8-Bit

Program Memory Size

16KB 16K x 8

Connectivity

SMBus (2-Wire/I2C), SPI, UART/USART

Bit Size

8

Access Time

25 μs

Has ADC

YES

DMA Channels

NO

Data Bus Width

8b

PWM Channels

NO

Number of Timers/Counters

4

Density

128 kb

Number of ADC Channels

17

Number of I2C Channels

1

Height

950μm

Length

5mm

Width

5mm

REACH SVHC

No SVHC

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant

Lead Free

Lead Free