Shindengen 2SK2196

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Number of Terminals

3

Transistor Element Material

SILICON

Package Description

FLANGE MOUNT, R-PSFM-T3

Package Style

FLANGE MOUNT

Moisture Sensitivity Levels

2

Package Body Material

PLASTIC/EPOXY

Reflow Temperature-Max (s)

NOT SPECIFIED

Operating Temperature-Max

150 °C

Rohs Code

No

Manufacturer Part Number

2SK2196

Turn-on Time-Max (ton)

135 ns

Package Shape

RECTANGULAR

Manufacturer

Shindengen Electronic Manufacturing Co Ltd

Number of Elements

1

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SHINDENGEN ELECTRIC MANUFACTURING CO LTD

Turn-off Time-Max (toff)

340 ns

Risk Rank

5.88

Part Package Code

TO-3P

Drain Current-Max (ID)

20 A

JESD-609 Code

e0

Terminal Finish

Tin/Lead (Sn/Pb)

Subcategory

FET General Purpose Power

Terminal Position

SINGLE

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

THROUGH-HOLE

Peak Reflow Temperature (Cel)

240

Reach Compliance Code

unknown

Pin Count

a count of all of the component leads (or pins)

3

JESD-30 Code

R-PSFM-T3

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

SINGLE WITH BUILT-IN DIODE

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Case Connection

DRAIN

Transistor Application

SWITCHING

Polarity/Channel Type

N-CHANNEL

Drain Current-Max (Abs) (ID)

20 A

Drain-source On Resistance-Max

0.35 Ω

Pulsed Drain Current-Max (IDM)

60 A

DS Breakdown Voltage-Min

500 V

FET Technology

METAL-OXIDE SEMICONDUCTOR

Power Dissipation-Max (Abs)

125 W

Power Dissipation Ambient-Max

125 W