LH28F320S3NS-L11
SOP
1730709-LH28F320S3NS-L11
IC FLASH 32M PARALLEL 56SSOP
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
The center distance from one pole to the next.
An indicator of formal certification of qualifications.
Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.
The memory capacity is the amount of data a device can store at any given time in its memory.
A phase of operation during the operation and maintenance stages of the life cycle of a facility.
A special high-voltage supply that supplies the potential and energy for altering the state of certain nonvolatile memory arrays. On some devices, the presence of VPP also acts as a program enable signal (P).
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.