Sharp GP2AP02VT20F

Moisture Sensitive

Yes

Factory Pack QuantityFactory Pack Quantity

10000

Manufacturer

Sharp Microelectronics

Brand

Sharp Microelectronics

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Reel

Subcategory

Sensors

Interface

I2C/SPI/UART

Program Memory Size

256 KB

Data Bus Width

32 Bit

Product Category

a particular group of related products.

Proximity Sensors

Device Core

Used in casting and moulding processes to produce internal cavities and reentrant angles (an interior angle that is greater than 18°).

ColdFire