GL 5EG8
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31965305-GL 5EG8
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
a process by which the operating system makes files and directories on a storage device (such as hard drive, CD-ROM, or network share) available for users to access via the computer's file system.
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.
The center distance from one pole to the next.
a count of all of the component leads (or pins)
the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.
Current which flows upon application of forward voltage.
the amount of voltage needed to get current to flow across a diode.
In photometry, luminous intensity is a measure of the wavelength-weighted power emitted by a light source in a particular direction per unit solid angle, based on the luminosity function, a standardized model of the sensitivity of the human eye.
Lenses are classified by the curvature of the two optical surfaces. A lens is biconvex (or double convex, or just convex) if both surfaces are convex. If both surfaces have the same radius of curvature, the lens is equiconvex. A lens with two concave surfaces is biconcave (or just concave).
the voltage drop across the diode if the voltage at the cathode is more positive than the voltage at the anode