Semtech Corporation ECLAMP5100ZATFT

Factory Lead Time

8 Weeks

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Diode Element Material

SILICON

Number of Elements

1

Operating Temperature (Max.)

125°C

Operating Temperature (Min.)

-40°C

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Series

EClamp™

JESD-609 Code

e4

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

2

Terminal Finish

NICKEL GOLD

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

NO LEAD

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Base Part Number

ECLAMP

Reference Standard

IEC-61000-4-2

JESD-30 Code

R-XBCC-N2

Polarity

BIDIRECTIONAL

Configuration

SINGLE

Diode Type

TRANS VOLTAGE SUPPRESSOR DIODE

Rep Pk Reverse Voltage-Max

5V

Non-rep Peak Rev Power Dis-Max

25W

Breakdown Voltage-Min

6.5V

Breakdown Voltage-Max

10.5V

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant