Semtech TS32101EVB

Mounting Type

Through Hole

Material - Insulation

--

Mounting Hole Diameter

0.056 (1.42mm)

Length Below Flange

--

Contact Materials

Brass

Length Above Flange

--

Package

Tray

Mfr

Semtech Corporation

Product Status

Obsolete

Series

AMPMODU

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Termination

Press-Fit

Insulation Color

--

Contact Finish

Tin

Note

-

Current - Output

1.5A

Voltage - Output

3V ~ 5.5V

Frequency - Switching

2MHz

Utilized IC / Part

TS32101

Supplied Contents

Board(s)

Insulation

Non-Insulated

Terminal Type

Terminal type or emulation specifies how your computer and the host computer to which you are connected exchange information.

Single Post

Board Type

Fully Populated

Main Purpose

DC/DC, Step Up

Flange Diameter

Flange diameter is measured between centers of opposite holes in the hub flange. It is usually between 38 and 67 millimeters. Note that it is NOT the outside diameter of the hub's flange. Left and right flange diameters are often, but not always, the same.

--

Outputs and Type

1, Non-Isolated

Terminal Style

Smooth

Regulator Topology

Boost

Pin Size - Above Flange

0.045 (1.14mm) Square

Pin Size - Below Flange

0.045 (1.14mm) Square

Contact Finish Thickness

100.0µin (2.54µm)

Length - Overall

0.480 (12.19mm)

Board Thickness

0.100 (2.54mm)