Semtech JANTXV1N5809US

Mounting Type

Surface Mount

Package / Case

SQ-MELF

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Supplier Device Package

-

Diode Element Material

SILICON

Number of Terminals

2

Package

Bulk

Base Product Number

1N5809

Mfr

Semtech Corporation

Product Status

Discontinued at Digi-Key

Package Description

HERMETIC SEALED, GLASS, MELF-2

Package Style

LONG FORM

Package Body Material

GLASS

Operating Temperature-Min

-65 °C

Reflow Temperature-Max (s)

NOT SPECIFIED

Operating Temperature-Max

175 °C

Rohs Code

No

Manufacturer Part Number

JANTXV1N5809US

Power Dissipation (Max)

5 W

Package Shape

ROUND

Manufacturer

Microsemi Corporation

Number of Elements

1

Part Life Cycle Code

Active

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

1.84

Part Package Code

MELF

Series

*

JESD-609 Code

e0

Pbfree Code

No

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Terminal Finish

Tin/Lead (Sn/Pb)

Applications

ULTRA FAST RECOVERY

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

HIGH RELIABILITY, METALLURGICALLY BONDED

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8541.10.00.80

Terminal Position

END

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

WRAP AROUND

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

compliant

Pin Count

a count of all of the component leads (or pins)

2

Reference Standard

MIL-19500

JESD-30 Code

O-LELF-R2

Qualification Status

An indicator of formal certification of qualifications.

Qualified

Configuration

SINGLE

Speed

Fast Recovery =< 500ns, > 200mA (Io)

Diode Type

Standard

Current - Reverse Leakage @ Vr

5 µA @ 100 V

Voltage - Forward (Vf) (Max) @ If

875 mV @ 4 A

Case Connection

ISOLATED

Operating Temperature - Junction

-

Output Current-Max

3 A

Voltage - DC Reverse (Vr) (Max)

100 V

Current - Average Rectified (Io)

6A

Number of Phases

1

Reverse Recovery Time

30

Rep Pk Reverse Voltage-Max

100 V

Capacitance @ Vr, F

60pF @ 5V, 1MHz

Non-rep Pk Forward Current-Max

125 A

Diode Configuration

Single

Repetitive Peak Reverse Voltage

100

Reverse Recovery Time-Max

0.03 µs

Reverse Recovery Time (trr)

30 ns