Seeed Technology Co., Ltd 104990130

Package / Case

18-DIP (0.600, 15.24mm)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Size / Dimension

1.091 Hx0.787W x 0.335 D 27.70mmx20.00mmx8.50mm

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Color

White

Voltage - Forward (Vf) (Typ)

3V

Current - Test

10mA

Millicandela Rating

85.5mcd

Wavelength - Peak

465nm

Display Type

16-Segment, Alphanumeric

Number of Characters

1

Digit/Alpha Size

0.80 20.32mm

Common Pin

Common Anode