Schott Corporation 24518

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

Nonstandard

Shell Material

POLYAMIDE

Contact Finish Mating

TIN OVER NICKEL

Contact Materials

BRASS

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Size / Dimension

0.895Lx0.660W 22.73mmx16.76mm

Tolerance

±10%

JESD-609 Code

e3

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Discontinued

Moisture Sensitivity Level (MSL)

Not Applicable

Connector Type

MAINS POWER CONNECTOR

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

STANDARD: IEC 320/C14, BRASS, NICKEL PLATED ALSO AVAILABLE

MIL Conformance

NO

DIN Conformance

NO

IEC Conformance

YES

Total Number of Contacts

3

Shielding

Unshielded

Current Rating

Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.

2.1A

Contact Gender

MALE

Inductance

100μH

Termination Type

SOLDER

Test Frequency

a statistical procedure for assessing data that contain counts or the numbers of occurrences of various categories or classes.

10kHz

DC Resistance (DCR)

90mOhm Max

Coupling Type

SNAP

Contact Finish Termination

TIN OVER NICKEL

Current - Saturation

1.77A

Height Seated (Max)

0.315 8.00mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Non-RoHS Compliant