MCSESM243F4LG0

Schneider MCSESM243F4LG0

Part No:

MCSESM243F4LG0

Manufacturer:

Schneider

Datasheet:

-

Package:

-

AINNX NO:

42614639-MCSESM243F4LG0

Description:

Modicon Managed Switch 20TX/4GE SFP

Products specifications
  • Contact Plating

    Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

    Tin
  • Material
    Copper
  • Unit Weight
    0.396479 oz
  • Factory Pack QuantityFactory Pack Quantity
    25
  • Mounting Styles
    Cable Mount / Free Hanging
  • Contact Materials
    Copper
  • Wire Gauge Max
    8 AWG
  • Manufacturer
    TE Connectivity
  • Brand
    TE Connectivity / AMP
  • RoHS
    Details
  • Insulation Materials
    Not Insulated
  • Maximum Bundle Diameter
    8.6 mm
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Type
    Butt
  • Gender
    Female
  • Subcategory
    Terminals
  • Termination Style
    Crimp
  • Wire Gauge

    a measurement of?wire?diameter.?This determines the amount of electric current the wire can safely carry, as well as its electrical resistance and weight.

    8 AWG
  • Insulation
    Not Insulated
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    Terminals
  • Product
    Splices
  • Mounting Angle
    Straight
  • Product Category

    a particular group of related products.

    Terminals
  • Length
    37.08 mm
0 Similar Products Remaining