Sangdest Microelectronics (Nanjing) Co Ltd MUR1060

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Diode Element Material

SILICON

Number of Terminals

2

Exterior Housing Material

1

Transport packaging size/quantity

48*32*27/15000

Gross weight

0.66

Package Style

FLANGE MOUNT

Package Shape

RECTANGULAR

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-55 °C

Operating Temperature-Max

150 °C

Forward Voltage-Max (VF)

2.2 V

Package Description

LEAD FREE, PLASTIC PACKAGE-3/2

Ihs Manufacturer

SANGDEST MICROELECTRONICS (NANJING) CO LTD

Part Life Cycle Code

Obsolete

Rohs Code

Yes

ECCN Code

EAR99

Type

Plastic cable entry SB series (budget)

Color

black

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

LOW LEAKAGE CURRENT

Terminal Position

SINGLE

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

THROUGH-HOLE

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

compliant

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

JESD-30 Code

R-PSFM-T2

Configuration

SINGLE

Diode Type

RECTIFIER DIODE

Number of Phases

1

Rep Pk Reverse Voltage-Max

600 V

JEDEC-95 Code

TO-220AC

Non-rep Pk Forward Current-Max

125 A

Reverse Current-Max

5 μA

Reverse Recovery Time-Max

0.05 μs

2nd Connector Number of Positions Loaded

ULTRA FAST RECOVERY